Layer:6 layer
Board Thickness :1.6MM
Material:FR-4
Surface Finish:Immersion gold 3µ”
Cu Thinkness (Outer/Inner):1/H oz
Layer:4 layer
Surface Finish:Immersion gold 2µ”
Cu Thinkness:1 oz
Layer:4 layer (Edge Through )
Board Thickness :1.0MM
Surface Finish:Entek(OSP)
Board Thickness :2.0MM
Surface Finish:Entek(OSP) + electric gold
Cu Thinkness (Outer/Inner):2/6 oz
Layer:12 layer
Board Thickness :3.2MM
Surface Finish:Entek (OSP)
Cu Thinkness (Outer/Inner):2/3 oz
Layer:8 layer
Board Thickness :1.27MM
Surface Finish:Immersion gold 5µ"+Card Edge
Impedence : 60Ω、40Ω、62Ω、88Ω
Layer:6 layer (Build up)
Board Thickness :0.8MM
Surface Finish:Immersion gold 2µ"