Will Taiwan Technology Co., Ltd.
NAIA Member(Others)
Product Name |
| Multilayer board |
Product Description |
Layer：6 layer Board Thickness :1.6MM Material：FR-4 Surface Finish：Immersion gold 3µ” Cu Thinkness (Outer/Inner)：1/H oz |
Product Name |
| Multilayer board |
Product Description |
Layer：4 layer Board Thickness :1.6MM Material：FR-4 Surface Finish：Immersion gold 2µ” Cu Thinkness：1 oz |
Product Name |
| Multilayer board |
Product Description |
Layer：4 layer (Edge Through ) Board Thickness :1.0MM Material：FR-4 Surface Finish：Entek(OSP) Cu Thinkness：1 oz |
Product Name |
| Multilayer board |
Product Description |
Layer：4 layer Board Thickness :2.0MM Material：FR-4 Surface Finish：Entek(OSP) + electric gold Cu Thinkness (Outer/Inner)：2/6 oz |
Product Name |
| Multilayer board |
Product Description |
Layer：12 layer Board Thickness :3.2MM Material：FR-4 Surface Finish：Entek (OSP) Cu Thinkness (Outer/Inner)：2/3 oz |
Product Name |
| Multilayer board |
Product Description |
Layer：8 layer Board Thickness :1.27MM Material：FR-4 Surface Finish：Immersion gold 5µ"+Card Edge Cu Thinkness：1 oz Impedence : 60Ω、40Ω、62Ω、88Ω |
Product Name |
| Multilayer board |
Product Description |
Layer：6 layer (Build up) Board Thickness :0.8MM Material：FR-4 Surface Finish：Immersion gold 2µ" Cu Thinkness：1 oz |